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Samsung Exynos 2500 unveiled, new 3nm chipset possible energy upcoming flagships

Samsung has formally unveiled the Exynos 2500, its newest flagship cell processor, designed to reinforce efficiency and AI capabilities in premium smartphones. The chipset, constructed on a 3nm Gate-All-Round course of, will possible seem within the upcoming Galaxy Z Flip.

Exynos 2500: Superior 3nm chip with improved AI and efficiency.(Samsung)

Samsung used its 3nm Gate-All-Round (GAA) manufacturing course of for the brand new SoC. This new technique not solely makes the Exynos 2500 bodily smaller but in addition enhances its energy effectivity and warmth dissipation. All this new know-how makes the brand new chip notably extra environment friendly and highly effective than its predecessor, the Exynos 2400.

Samsung’s first deca-core chip

The Exynos 2500 contains a deca-core CPU organized in a quad-cluster configuration. This contains one prime core, Cortex X925, clocked at 3.3 GHz for heavy lifting. The remainder embrace two Cortex A725 at 2.76 GHz, 5 Cortex A725 at 2.35 GHz, and two Cortex A520 at 1.8 GHz.

This new setup delivers a 15% improve in efficiency over the earlier era. The GPU is Xclipse 950, which is constructed on AMD’s RDNA 3 structure. With 8 Work Group Processors (WGPs) and eight Render Backends (RBs), this GPU provides a 28% enhance in body charges and hardware-accelerated ray tracing. This can be a important enchancment over the Exynos 2400 in gaming and different GPU-based workloads.

AI, digital camera and connectivity

Samsung has added a strong Neural Processing Unit (NPU) within the Exynos 2500 to allow on-device AI options. This new NPU is able to 59 trillion operations per second (TOPS), a big enchancment over the Exynos 2400.

On the imaging entrance, the Exynos 2500 helps as much as 320 MP digital camera sensors with 8K video recording at 30 fps. It additionally options multi-layer noise discount and Dynamic Vary Compression (DRC) for sharper images and movies.

Samsung future-proofed the Exynos 2500 with assist for Wi-Fi 7, Bluetooth 5.4, 5G (sub-6GHz and mmWave), and satellite-based messaging (NTN assist). The chip additionally helps LPDDR5X RAM and sooner UFS 4.1 storage for seamless multitasking and sooner knowledge processing.

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